PART |
Description |
Maker |
G7752-10 G7754-03 G7751-02 G7751-21 G7754-01 G7751 |
Active area: 0.6mm; external input voltage: -18V; infrared detector module with preamplifier: high sensitivity module of easy-to-use. For infrared detection Tantalum Conformal-Coated Capacitor; Capacitance: 47uF; Voltage: 6.3V; Packaging: Tape & Reel 红外探测器与前置放大器模 Tantalum Conformal-Coated Capacitor; Capacitance: 47uF; Voltage: 6.3V; Packaging: Tape & Reel Tantalum Conformal-Coated Capacitor; Capacitance: 47uF; Voltage: 6.3V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
|
Hamamatsu Photonics K.K. HAMAMATSU[Hamamatsu Corporation]
|
N111202 |
PACKAGING: 75 PCS TUBE
|
E-SWITCH
|
PSR54-9P PSA55-9R PSA55-7I PSR53-7R PSR53-9P PSR53 |
60V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF054 with Standard Packaging Analog IC Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to the iP2003A in Tape and Reel packaging. 500V Single N-Channel Hi-Rel MOSFET in a TO-259AA package; A IRFI460 with Standard Packaging 400V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY340CM with Standard Packaging Synchronous Buck Multiphase Optimized BGA Power Block.; Tape and Reel version of the iP2002 -100V Single P-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE9110 with Standard Packaging Synchronous Buck Multiphase Optimized BGA Power Block.; A IP2002 with Standard Packaging -100V Single P-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6845 with Standard Packaging 模拟IC Dual Output Full Function 2 Phase Synchronous Buck Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; A IP1202 with Standard Packaging 模拟IC
|
TE Connectivity, Ltd.
|
SG-636PTF SG-636PCE SG-636PCW SG-636PH SG-636PHW S |
Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 4V; Case Size: 3.5x2.8 mm; Packaging: Tape & Reel 高频晶体振荡 Tantalum Molded Capacitor; Capacitance: 10uF; Voltage: 4V; Case Size: 4x3.2 mm; Packaging: Tape & Ammo 高频晶体振荡 HIGH-FREQUENCY CRYSTAL OSCILLATOR 高频晶体振荡 Tantalum Molded Capacitor; Capacitance: 22uF; Voltage: 4V; Case Size: 2x1.3 mm; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 10uF; Voltage: 4V; Case Size: 4x3.2 mm; Packaging: Tape & Ammo Tantalum Molded Capacitor; Capacitance: 2.2uF; Voltage: 4V; Case Size: 2x1.3 mm; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 3.3uF; Voltage: 4V; Case Size: 2x1.25 mm; Packaging: Tape & Ammo Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 4V; Case Size: 3.5x2.8 mm; Packaging: Tape & Reel Tantalum Molded Capacitor; Capacitance: 3.3uF; Voltage: 4V; Case Size: 4x3.2 mm; Packaging: Tape & Ammo
|
Electronic Theatre Controls, Inc. Epson ToYoCom ETC[ETC] List of Unclassifed Manufacturers
|
KA741 KA741D KA741I KA741DTF |
Single Operational Amplifier Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 16V; Case Size: 1.7x3.3 mm; Packaging: Tape & Reel Tantalum Conformal-Coated Capacitor; Capacitance: 4.7uF; Voltage: 16V; Packaging: Tape & Reel From old datasheet system
|
Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
|
PST9346U PST9319U PST9342U PST9339U PST9338U PST93 |
-40V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7241 with Lead Free Packaging -55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR9024NCPBF with Standard Packaging -55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF9Z24NS with Standard Packaging -20V Single P-Channel HEXFET Power MOSFET in a Micro 3 package; A IRLML6402 with Tape and Reel Packaging -55V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF5305 with Standard Packaging Voltage Detector 电压检测器 -12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7220 with Standard Packaging 电压检测器 -30V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7406 with Standard Packaging -100V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU9120N with Standard Packaging
|
Maxim Integrated Products, Inc.
|
DB2430100L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
DB2460100L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
DB5H411K |
DB5H411K0L Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
AM29821DM AM29825DM AM29823DM AM29821DC AM29821A/B |
10-Bit D-Type Flip-Flop 300V 1 Form A Photo Voltaic Relay in a mod. 8-pin DIP Package; A PVA3324N with Standard Packaging Complete Sensorless Drive Design Platform iMOTION Development System; A IRMCS2031 with Standard Packaging High-voltage DC-DC buck converter for HB-LEDs constant current control; A IRPLLED1 with Standard Packaging 9-Bit D-Type Flip-Flop 20V 1 Form A Photo Voltaic Relay in a 6-pin DIP Package; A PVN012 with Standard Packaging Halogen Convertor, 220/230VAC Input, 12VAC Output, 100VA Max; A IRPLHALO1E with Standard Packaging 250V 1 Form A Photo Voltaic Relay in a 6-pin SMT Package; A PVT312LS with Tape and Reel Packaging Digital dimming DALI (Digital Addressable Lighting Interface) compliant lighting linear ballast with 1% dimming, IR2159, U.S. version, 120VAC line, 32W/T8 lamp; A IRPLDIM2U with Standard Packaging A 3-Way CFL Dimming Ballast; A IRPLCFL4 with Standard Packaging 10位D型触发器 Octal D-Type Flip-Flop 八路D类触发器
|
Analog Devices, Inc.
|